Features: 1. This machine has the strong and perfect function selection, with eight temperature waves in the memory software, you can select the right temperature wave according to the solder/unsolder request. 2. Intelligent temperature wave heating, can achieve the solder/unsolder automatically. 3. Three-dimensional adjustable lamp body, use laser light, suitable for unsoldering any-angle components. 4. PID intelligent temperature control can avoid the IC damage due to the fast or uninterrupted warming up. 5. This machine has a super hot melt system, use infrared welding technology which is developed independently, heat is easy to pierce and distribute evenly, can suit for a variety of computer, notebook, play station s  BGA components, especially in a Northbridge/ Southbridge chipset of computer. 6. Friendly human-machine operation interface, perfect LCD display, you can watch the whole repairing process very clearly. 7. Ergonomic design, practical and easily operated. Good build quality but at the same time light weight and a small footprint allows the T-890 to be easily bench positioned, transported or stored. Technical parameters: Complete machine power: 1500W Rated voltage and frequency: AC 220 V Infrared lamp body power: 300 W Preheating chassis power: 1200 W Working bench size: 320 X 330 mm Infrared lamp body heating size: 60 X 60 mm Preheating chassis preheating size: 245 X 260 mm Preheating chassis temperature range: 0C-350C Size: 390mm X 220mm X 620mm Net weight: 11.5 kg